We performed multi-hole processing in a staggered grid pattern on a 50μm thick PI (polyimide) with an entrance diameter of Φ17μm, an exit diameter of Φ6μm, and a pitch of 25μm.
Holes were processed in a staggered lattice pattern on a 50μm thick PI (polyimide) with an inlet diameter of Φ17μm, an outlet diameter of Φ6μm, and a pitch of 25μm.
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basic information
The processing process of PI (polyimide) with an excimer laser involves instantaneously irradiating energy greater than the intermolecular bonding forces of the material, breaking the intermolecular bonds at that site, and causing gasification or ultra-fine particle formation. This enables high-quality processing with minimal thermal impact. Additionally, excimer laser light can achieve a relatively large and flat beam profile, allowing the use of an imaging optical system that incorporates a mask into the optical path to transfer the shape of the mask to the processing point. Compared to methods that use focused laser light like other lasers, it allows for fine processing of arbitrary shapes and simultaneous processing of many holes. - Processing is possible for a wide variety of materials, from resins to metal films. - With a wavelength in the ultraviolet range (248nm), it has a higher energy absorption rate and high peak energy, enabling high-precision micro-processing with less thermal impact than other lasers. - Depth control of the processed area is possible, allowing for groove processing at the micron level. - Large area processing in bulk is possible through synchronization of the laser light and optical system.
Price information
Prices may vary depending on processing specifications and quantities, so please feel free to contact us.
Delivery Time
※The delivery date may vary depending on the processing specifications and quantity, so please feel free to contact us.
Applications/Examples of results
Electronic components and semiconductor-related
Company information
At Lips Works Co., Ltd., we provide contract micro-fine processing using ultra-short pulse lasers, as well as the design and manufacturing of laser systems. In our contract processing business, we have been quick to engage in the development of industrial ultra-short pulse lasers and have been involved in contract micro-fine processing using these lasers. We specialize in applying fine periodic structures (microtextures) to work surfaces aimed at controlling tribological properties, optical properties, and release/adhesion characteristics. We can accommodate requests from small-scale prototypes to mass production according to our customers' needs. In our system engineering business, we leverage the laser processing technology cultivated in our job shop to provide a comprehensive service from selecting laser oscillators suitable for applications, designing optical systems, devising fixtures and auxiliary equipment, to system integration. We assist in improving the precision and efficiency of the processing required by our customers. As experts in laser technology providing cutting-edge laser processing techniques, we strive to be a valuable resource for our customers, so please feel free to contact us.
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