2 inches; 3 inches; 4 inches; 5 inches; 6 inches; 8 inches; 12 inches. Dummy wafers available for each grade up to prime wafers.
A wafer is a material used in the manufacturing of semiconductor devices. It is a disk-shaped slice made from a cylindrical ingot of highly composition-controlled single-crystal silicon. The term is derived from the wafers used in Western confections (both referred to as wafer in English). In addition to "wafer," it is also referred to by various names such as "weha," "weha," "weha," "weha," and others.
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basic information
The diameter of wafers ranges from 50mm to 300mm, and as the diameter increases, more IC chips can be cut from a single wafer, leading to larger diameters over the years. Since around 2000, 300mm silicon wafers have been put into practical use, and by 2004, they accounted for about 20% of silicon wafer production volume. The thickness of wafers is typically made to be around 0.5mm to 1mm for ease of handling during the manufacturing process. For standard silicon wafers, the external dimensions are standardized by industry organizations such as SEMI (Semiconductor Equipment and Materials International). For a diameter of 150mm (6 inches), the thickness is 0.625mm; for 200mm (8 inches), it is 0.725mm; and for 300mm (12 inches), it is 0.775mm. The thickness tolerance is ±0.025mm. To align the orientation of the wafers during processing, there are notches called "orifla" or "notches." Additionally, to ensure that the crystal structure is oriented in the direction most suitable for the operation of the semiconductor devices being manufactured, wafers are sliced along specific crystal orientations, and the position of the orifla is determined by the conductivity type and crystal orientation.
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Significant fluctuations depending on quantity. We are confident in our prices.
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P1
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※Delivery time varies depending on the quantity.
Applications/Examples of results
Semiconductor devices are made using silicon wafers. Silicon wafers are classified into various types, and the main products and their applications are as follows: ● As-cut wafers, wrapped wafers, etched wafers General individual semiconductor devices such as transistors, diodes, rectifiers, thyristors, and various sensors ● Polished wafers Semiconductor integrated circuits such as ICs, LSIs, ultra LSIs, CCDs, and various sensors ● Epitaxial wafers Individual semiconductor devices such as small-signal transistors and special diodes, CCDs, and semiconductor integrated circuits (MOS-IC) ● Embedded diffusion wafers, embedded diffusion epitaxial wafers Semiconductor integrated circuits (Bip-IC) ● Diffusion wafers Power transistors ● SOI wafers High-speed, high-reliability, low-power semiconductor integrated circuits
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1. Dicing tape; BG (Back Grinding) tape; Dicing tape; Protective tape for back grinding of wafers. 2. Silicon wafer for semiconductors: Polished wafer (PW) annealed wafer, epitaxial wafer (EW), epitaxial wafer with embedded layer (JIW), SOI wafer, reclaimed wafer (RPW). 3. Lamp; low-pressure lamp; high-pressure lamp. 4. UV machine; Dicer; UV irradiator; tape expansion device; tape application device; ultraviolet irradiation device; ultraviolet dry cleaning device.
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