A system that captures the edge of a rotated wafer with a line sensor to detect fine defects on the order of a few microns.
This is a system that captures the rotated wafer edge with a line sensor to detect fine defects on the order of a few microns. It can also handle massive images exceeding 1 GB.
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basic information
**Features** - High-speed three-band defect detection filter - Rotational distortion correction - Real-time simulator for inspection recipe settings - D-Viewer **Product Specifications** - Target Size: 200–300 mm wafer edge and near-edge front and back surfaces - Resolution: 3μ–10μ/pixel - Resolution: Color: (2300–7500)×300000×3[pixels] Black and White: (320–1024)×300000[pixels] - Target Defects: Scratches, chips, cracks, delamination, dirt, foreign objects, unevenness, discoloration, etc. *For more details, please contact us.*
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Company information
We are engaged in image recognition systems and robot control that incorporate our unique learning/recognition algorithms based on insights from artificial intelligence (AI), neuroscience, and the latest image processing technologies. We provide various technologies that easily capture (learn) a wide variety of rapidly changing subjects, reliably match and identify (recognize) them, and visually represent the results. We aim to be of assistance to those involved in the development of video processing devices, surveillance systems, medical imaging equipment, semiconductor manufacturing equipment, and robots.