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Trinity Corporation is engaged in the purchase of silicon materials for solar power generation and semiconductors. Scrap materials entrusted by customers are analyzed, sorted, measured, processed, and, if necessary, crushed under a consistent operation at our own factory and partner facilities. After purchasing them at appropriate prices that reflect market fluctuations, we recycle them as resources. If you have been paying disposal fees to discard silicon materials such as wafers, please feel free to consult with us. 【Items for Collection】 ■ Ingot: P-type/N-type/Various diameters ■ Top Tail: P-type/N-type ■ Polycrystalline Silicon: From fine grains to large chunks ■ Pot Scrap: P-type/N-type ■ Kamaboko Material: P-type/N-type *For more details, please refer to the PDF document or feel free to contact us.
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【Other Collection Items】 ■Wafers ・For semiconductors: Bare/film/pattern *Crushing treatment is also possible for information protection ・For solar power generation: Monocrystalline and polycrystalline wafers ■Broken wafers: Monocrystalline and polycrystalline ■Solar cells ■Cassette cases ■Fluororesin ■Photomasks ■Rare metals *For more details, please refer to the PDF document or feel free to contact us.
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Trinity primarily offers silicon wafers for semiconductors as our main product. We handle silicon wafers ranging in size from 2" to 12", and at our factory, we sort, inspect, and measure the silicon wafers that arrive daily to ensure stable quality and quick delivery, responding to customer demands with a rich inventory. We also provide dummy grade to monitor grade (particle-controlled products), thin wafers, patterned wafers, and more. Additionally, we offer film deposition processing. We handle wafers with thermal oxide films, sputtering, evaporation, and CVD, and we accept contract film deposition processing tailored to customer needs, from small-scale prototypes to mass production. Besides silicon wafers, we also offer SiC wafers in various grades. We provide high-quality SiC wafers at reasonable prices. We also accept processing for SiC wafers, including dicing, thickness specification, and bonding.