12-inch Si double-sided polished wafer, Φ300mm silicon substrate, thickness 775±25um, P-type <100>, 1-100Ω·cm, double-sided mirror.
Quality: Particle management available (0.2um, 30 or fewer) Manufacturing: Made in Japan Delivery time: 1-2 weeks
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basic information
<SPEC> Diameter: Φ300±0.2mm Thickness: 775±25um Type: P (Boron) Resistivity: 1-100Ω・cm Crystal Orientation: <100> Notch Orientation: <110> GBIR≦10um BOW≦±30um LPD: ≧0.2um, ≦30/Wafer Metal Contamination: Al, Ca, Cr, Fe, K, Na, Ni, Zn, Cu: ≦1E10 atoms/cm2
Price range
P1
Delivery Time
P3
※1-2Week
Applications/Examples of results
Applications: Substrate materials related to semiconductors Substrate materials related to optics Others
Company information
The doujin industry provides various semiconductor materials and precision processing. We handle main products such as silicon, sapphire, SiC, GaN, quartz, alumina, and sintered SiC, and we have established a system that allows for integrated production from crystal growth to wafer processing in-house. In addition to standard semi-products, we also offer custom solutions, characterized by our flexibility in responding to requests regarding size, processing type, and quantity. We also handle crystal materials such as silicon, sapphire, SiC, GaN, LN, LT, quartz, GaAs, CaF2, MgF2, as well as consumables like quartz, fine ceramics, polishing materials, wafer cases, wire saw equipment, and diamond wires. The doujin industry is globally expanding its business from material procurement to processing. Strong support from overseas group companies, partner companies, and networks forms an important foundation of our capabilities. Through over 20 years of experience in trade between Japan, China, Korea, and Taiwan, we have built unique trade expertise and networks.
