A porous silicon formation device that further applies conventional anodic oxidation equipment. Porous silicon wafers are formed depending on the chemical solution used and the current density.
The anodizing device was traditionally a device that flowed current to form an oxide film, but the further developed porous silicon formation device is one that forms porous silicon by changing the chemical solution used and the current density. *For more details, please download the PDF (catalog) or feel free to contact us.*
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basic information
【Features】 ■ Fully automated formation of porous silicon. ■ Enables cassette-to-cassette operation without the use of back protection jigs. ■ Compatible with both N-type and P-type. ■ Supports various sizes from 2 to 6 inches. Please consult for sizes over 8 inches. As a nano-silicon technology, it expands possibilities for new application development in the fields of biomedical, secondary batteries, solar cells, and semiconductor processes. * Please consult regarding the diameter of the pores and the thickness of the porous silicon layer.
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Semiconductor manufacturing processes, electronic materials manufacturing processes, etc.
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Walking hand-in-hand with customers, challenging for creation of new values across a wide range of fields– DALTON’s existence, with the dual business domains of laboratory equipment and industrial machinery, truly shines as we play the role of a partner to customers who have strong passion for creating new values. A long with our unique group firms and suppliers, we have built a long history of trust with our customers who’ve been the main players to create new values insociety. -Creating new values together.- Dalton Group are pooling our knowledge and technology together, merging it with our customers’creative endeavors to create new and innovative values that contribute to an affluent society and abright future.
