We have the measurement technology and know-how to meet various requests.
Particle size distribution measurement can be performed using laser diffraction and scattering methods, high-transmittance centrifugal sedimentation methods, acoustic methods (dry classification), and vibration methods (dry and wet classification). These methods can be conveniently used for one-time measurements or for intermittent measurements as part of quality control. You can obtain the necessary data quickly and accurately whenever needed. At the Seishin Corporation Powder Measurement Center, we possess the measurement technology and know-how to meet your needs. We pride ourselves on having the best knowledge and experience in Japan regarding powders. For more details, please download the catalog.
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basic information
【Specifications】 ○ Laser diffraction and scattering method Measurement range: 0.01μm to 3500μm (1 range) ○ High-transmittance centrifugal sedimentation method Measurement range: 0.1μm to 500μm (1 range) ○ Acoustic method (dry classification) Measurement range: 20μm to 5600μm ○ Vibration method (dry and wet classification) Measurement range: 20μm and above ○ Delivery time: 2 to 3 days (1 week for high-transmittance centrifugal sedimentation method only) ● For more details, please contact us or download the catalog.
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Company information
To create high-quality products, powder technology is an essential foundational technology. Since our establishment in 1968, we have consistently strived to acquire high-level powder technology. In particular, our contract processing division has become our mainstay, having cultivated extensive experience and achievements. We have responded to a wide range of customer requests, handling the processing of many materials and refining various processing techniques such as crushing, classification, mixing, drying, coating, and compounding. The fine powder products developed using the processing technologies gained from our extensive contract processing experience are our original offerings. These products utilize our unique chemical grinding technology, enabling us to achieve a level of grinding that cannot be obtained through other grinding methods, as well as allowing for special processing such as compounding with inorganic materials, compounding between resins, and surface coating.
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