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  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Film Attachment Device | Semi-Automatic Mounter "FM-3343"

Film Attachment Device | Semi-Automatic Mounter "FM-3343"

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FM-3343

last updated:May 09, 2023

TECHNOVISION, INC. main office
TECHNOVISION, INC. main office
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Auto-lamination without bubbles under preset pasting conditions.

A semi-automatic tabletop type small tape applicator compatible with 12 inches (300mm) tape. It is the optimal tape applicator that can accommodate the diverse conditions of tape application and lamination. This device responds to customers who wish to "automate the crucial application process" even with a manual device, and further "set application conditions and quantitatively manage application quality!" Even inexperienced operators can perform application tasks with stable quality, similar to that of skilled workers.

    Wafer processing/polishing equipmentOther semiconductor manufacturing equipmentMounter
3343e.jpg

Film Attachment Device | Semi-Automatic Mounter "FM-3343"

3343e.jpg
3343e.jpg
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basic information

■Features - Auto-lamination with preset attachment conditions - Compatible with various tapes/films - Variable attachment pressure - Variable speed for the attachment roller - Built-in circumferential tape cutter - Built-in horizontal tape cutter - Built-in automatic separator winding mechanism - Capable of non-contact surface attachment - Compatible with hot wafer chucks - Static electricity countermeasures available - Compact and lightweight - Tabletop design ■Benefits The main benefits of introducing a wafer mounter include "stable attachment quality," "speedy manufacturing operations," and "prevention of chip flying." By fully utilizing these features, an increase in productivity due to high yield can be expected. The pressure and speed during film attachment can be managed with digital display.

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Applications/Examples of results

A device for attaching "wafers," "dicing frames," and "various tapes." ■ Applications: - Dicing applications - DAF (Dicing Adhesive Film) applications - BG (Back Grind) applications - Functional tapes 【Dicing Applications】 After dicing the wafer with a dicer, dicing tape is attached to the back side to hold the wafer being cut during dicing, preventing the chips from falling apart. 【Protection (Back Grind/BG) Applications】 When performing back grinding on the backside of the wafer for thinning, protective tape is attached to protect the circuits on the surface. 【Others】 The device can also accommodate other roll-type films for film attachment (such as DAF attachment, resist film attachment, etc.).

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TechnoVision | Comprehensive Product Catalog

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Wafer/Film Attachment Device | Wafer Mounter

Wafer/Film Attachment Device | Wafer Mounter

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TECHNOVISION,

TECHNOVISION, INC. main office

Electronic Components and Semiconductors

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Techno Vision Co., Ltd. has been engaged in the development, manufacturing, and import/export of its own products, focusing on cleaning technology and assembly technology since its establishment in September 1987. In today's high-tech industry, we are committed to responding to our customers' needs and providing technology, products, and services from the perspective of our customers.

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