Thin film thickness and Young's modulus measurement device
It is possible to measure the thin film thickness, Young's modulus, and Poisson's ratio of a wafer substrate in a non-contact and non-destructive manner.
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basic information
A pulse laser is irradiated onto the surface of a thin film, and the energy converted to heat on the thin film causes thermal expansion. Acoustic vibrations occur on the locally expanded surface of the thin film. By introducing the frequency of these acoustic vibrations into a physical model, the film thickness, Young's modulus, and Poisson's ratio of the thin film can be calculated.
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Applications/Examples of results
- Film thickness measurement throughput: 55 sheets/hour (1 parameter measurement) 9 point measurement (with pattern recognition) optical system - Repeatability σ: Film thickness: 0.25% Young's modulus: 0.5% (Low-k film) - Optical system: Probe spot size: 15×30 μm Excitation acoustic wavelength: 2×11 μm - Load port: FOUP, SMIF, or OC; dual - Mini environment: Class 1000 cleanroom environment compliant with Class 1 - Automation: Compliant with GEM 300, SEMI 300mm, SEMI S2-0200, and CE, etc.
Company information
Semilab is a comprehensive measurement device manufacturer that supports research and manufacturing of cutting-edge technologies worldwide. We handle non-contact CV measurement devices, lifetime measurement devices, spectroscopic ellipsometers, photoluminescence, DLTS systems, sheet resistance measurement devices, nanoindenters, AFM, and more for the inspection of semiconductor wafers and devices. Please feel free to contact us for specifications and pricing of our devices.
