We design and manufacture handlers for various electronic components according to customer specifications.
We design and manufacture handlers for various devices (TSOP, BGA, QFP, CSP) and electronic components according to customer specifications. We offer technologies for processing multiple units, high-speed indexing, and environments ranging from room temperature to high temperature, as well as proposals tailored to applications from gravity drop transport methods to horizontal transport methods. As a low-cost dedicated machine, we contribute to the high efficiency of semiconductor and electronic component manufacturing processes. 【Features】 ■ Designed and manufactured according to customer specifications → Handlers for various devices (TSOP, BGA, QFP, CSP) and electronic components ■ Processing of multiple units ■ High-speed indexing ■ Technologies for room temperature and high temperature environments ■ Proposals tailored to applications from gravity drop transport methods to horizontal transport methods ■ Contributes to the high efficiency of semiconductor and electronic component manufacturing processes as a low-cost dedicated machine *For more details, please refer to the PDF materials or feel free to contact us.
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★ Both electrical design and mechanical design are supported, and the company continues to expand smoothly, with annual sales projected to increase from 9.7 billion yen last year to 12.5 billion yen this year (with the fiscal year ending this month). We have a total of 70 technical staff involved in various software designs such as measurement and control circuit design, image processing, mechatronics line design, and related peripheral designs, and the number of employees has exceeded 540. ★ Not only design but also sheet metal processing, machining, surface mounting, assembly, and inspection are in-house processes, ensuring short delivery times and high quality. In particular, we have equipment capable of handling large boards (500×600) and high-density boards (BGA, 0.5mm QFP) for circuit board assembly, and in the inspection process, we have equipment such as X-ray inspection machines and in-circuit testers. Additionally, we have renewed our equipment mainly at the Kumamoto, Hamamatsu, and Sagamihara factories. ★ In January 2015, we established the Sagamihara Division in addition to the Kyoto, Kumamoto, and Hamamatsu factories, creating a four-division structure, and in March 2016, new buildings began operations at the Kyoto and Kumamoto factories.
