Ventilation analysis was conducted using numerical simulation within the electronic device enclosure.
In the thermal airflow analysis of electronic device enclosures, we conducted ventilation analysis through numerical simulations within the enclosures. With the improvement of technology, electronic components are increasingly shrinking, making thermal issues within the enclosures unavoidable. The placement of high-heat-generating components and ventilation parts such as fans can significantly affect the performance of the devices themselves. We conducted the analysis to gain insights into this. For more details, please download the catalog.
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【Analysis】 - The shapes and positions of the frame, electronic components, fans, etc., inside the enclosure should be represented as faithfully as possible. - It is necessary that the surface area and other parameters related to the heat generation of each electronic component are correctly input. - If not correctly input, the heat generation per unit area will differ from the actual values, leading to different characteristics of the calculated heat convection. - The total number of grids is 106 (X) × 84 (Y) × 46 (Z) = 409,584. - A small number of grids can represent almost all major structures within the enclosure. 【Analysis Results】 - Inside the enclosure, there is a uniform airflow from the intake fan to the exhaust fan. - Heat from each heat-generating area is efficiently ventilated by this airflow. - There are some areas where heat affects non-heat-generating components. - This issue can be resolved by moving the installation position of the non-heat-generating components closer to the intake fan. - It is important to create a uniform airflow within the enclosure and to design the installation positions of heat-generating components along that airflow. ● For more details, please contact us or download the catalog.
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In environmental simulation, we develop and sell proprietary 3D fluid analysis programs and provide contract analysis services using these software tools. For over a decade, we have been engaged in thermal fluid analysis in fields such as architecture, civil engineering, machinery, and electronics, handling numerous analyses and accumulating a wealth of know-how and knowledge. Our diverse analysis and visualization functions, honed through practical experience, have received high praise as CFD software from many companies and research institutions. ● Import functionality for BIM-compatible CAD data such as Revit and DXF ● Map information (GIS) data import functionality ● SuperCartesian functionality that freely represents diagonal boundaries and complex curved surfaces ● High-speed, high-precision radiation calculations and high-precision turbulence analysis using DNS ● Moving boundary problem analysis functionality that accommodates the movement of multiple objects in space ● User-friendly interface and easy-to-understand animation features In addition to software support, we also accept contract analyses. Focusing on air conditioning ventilation and wind environment analysis, we provide high cost-performance solutions for a wide range of problems, from simple, small-scale issues to complex, large-scale analyses. We look forward to your visit, along with our abundant analysis case studies.
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