Full automatic spin cleaning device for 300mm/8-inch wafers, glass.
This device manually sets a wafer cassette into the main body, sends the stored target work to the spin cleaning section using a robot, and performs two-fluid cleaning, ultrasonic cleaning, and N2 blow drying while spinning, before storing it back in the wafer cassette.
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basic information
Device dimensions Size: W1300×D1800×H2000 (300mm) / W1100×D1400×H2000 (8 inches) Process: Manually place the cassette → Close the door and start operation → The robot transfers wafers one by one from the top of the cassette to the centering section → Centering with four cylinders → The robot sends the wafers from the centering section to the cleaning device → Two-fluid cleaning, ultrasonic cleaning, drying → The robot discharges the wafers from the cleaning device to the discharge cassette Cleaning stuff: 300mm and 8-inch wafers The degree of cleanliness: About class 100 Weight of the machine: within 600kg
Price information
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Price range
P7
Delivery Time
※Four months after receiving the order.
Applications/Examples of results
Ideal for cleaning applications after dicing For mobile camera modules
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.