The first fundamental book where essential basic knowledge for all fine wiring engineers and researchers can be learned! Understand the "root" of metal wiring reliability!
○Publication Date: December 25, 2006 ○Format: B5 size hardcover, 206 pages ○Price: 55,000 yen (excluding tax) → STbook member price: 52,190 yen (excluding tax) ○Supervision: Masamitsu Shinguihara, Professor, Kansai University ○Authors: Masamitsu Shinguihara, Kansai University / Tomoji Nakamura, Fujitsu Laboratories Ltd. / Takashi Suzuki, Fujitsu Laboratories Ltd. / Kiyoshi Nikawa, NEC Electronics Corp. / Takayuki Kitamura, Kyoto University / Junichi Koike, Tohoku University / Takako Sekiguchi, Tohoku University / Naohito Kawasaki, Freescale Semiconductor / Shinji Yokokawa, NEC Electronics Corp. / Kazuyoshi Ueno, Shibaura Institute of Technology / Kazuhiko Sasakawa, Hirosaki University / Hiroshi Miyazaki, Renesas Technology Corp. / King Ning Tu, UCLA / Annie T. Huang, UCLA / Fanyi Ouyang, UCLA
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basic information
Chapter 1: Overview of Reliability Issues in LSI Fine Metal Wiring Chapter 2: Diffusion Phenomena in Metal Thin Films Chapter 3: Stress and Plastic Deformation Chapter 4: Stress and Relaxation Phenomena in Thin Films and Wiring Chapter 5: Fundamentals of Electromigration Chapter 6: Fundamentals of Stress Migration Chapter 7: Evaluation and Analysis Techniques for Wiring Defects Chapter 8: Interface Adhesion Evaluation and Fine Wiring Reliability Chapter 9: Void Formation in Fine Wiring Due to Stress Migration Chapter 10: Electromigration in Via Structures Chapter 11: Migration Resistance of Barrier Metal-Capped Copper Wiring Chapter 12: Damage Prediction Modeling for Electromigration Chapter 13: Stress Migration in Multilayer Copper Wiring Chapter 14: Migration Phenomena in Solder Joint Technology
Price information
Main body: 55,000 yen + tax → STbook member price: 52,190 yen + tax
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P2
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P2
Applications/Examples of results
Metal
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S&T Publishing publishes technical books aimed at researchers and engineers.