Ultrasonic sieve machine Ultrasonic oscillator PNS model *Experimental examples are currently published.
PNS oscillator (generator)
[Low-cost model] Capable of generating ultrasonic vibrations with a mesh surface amplitude of ±1 to 10μm at ultrasonic frequencies of 33kHz to 37kHz!
The low-cost model oscillator PNS is capable of generating ultrasonic vibrations with a mesh surface amplitude of ±1 to 10μm (depending on specifications) at ultrasonic frequencies of 33kHz to 37kHz. It is an ultrasonic vibration screening unit designed to improve screening efficiency, reduce and prevent clogging, and decrease the number of cleaning cycles, adaptable to a variety of screening environments. Equipped with an automatic frequency tracking function similar to the DGS model, it can apply stable ultrasonic vibrations without being significantly affected by differences in frequency characteristics when mounted on various screening frames (rings). 【Features】 ■ Capable of generating ultrasonic vibrations at frequencies of 33kHz to 37kHz ■ Continuous operation possible with a basic setting of a 500Hz sweep width (reciprocal speed of 50Hz) ■ Successor model to the AGS model *For more details, please contact us or download the catalog.
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basic information
The PNS model will be the successor to the old AGS model.
Price information
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Delivery Time
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Applications/Examples of results
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Detailed information
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Example of attachment to standard sieve Example of standard JIS sieve attachment: φ75 to φ300 (JIS Z 8801) Compatible with a maximum of φ600mm.
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[Experimental Example] In the treated toner powder, the application of ultrasonic vibrations allows for the passage through the sieve in a short time without aggregation or clogging. Surface of the mesh after ultrasonic sieving.
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[Experimental Example] In treated toner powder, applying ultrasonic vibrations allows for passing through the sieve in a short time without agglomeration or clogging. Sieve surface after screening without ultrasound.
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.