Film application device
We bond functional films such as protective films, ASF, and AR films to glass substrates quickly and with high precision. The supply of films can be done either by supplying half-cut films on reels or by supplying shaped cut films as individual sheets.
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basic information
This is a device used for applying AR films, OCA films, ASF, protective films, etc., to glass substrates and other materials in the manufacturing processes of LCD televisions and smartphones. It can also be applied to the bonding of substrates to each other. It is capable of supplying films in both roll and sheet formats, allowing for stress-free, bubble-free application of films, as well as high-precision placement through image processing alignment.
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A device for applying AR films, OCA films, ASF, protective films, etc. to glass substrates and the like.
Company information
Shinko Engineering Co., Ltd. has continuously created unique products in the design and manufacturing field of information and communication technology-related devices and systems since its establishment. In particular, we have consistently demonstrated originality in motor drive technology for mechatronic equipment and conveyor systems, image processing technology for inspection and measurement devices, and application products of laser technology, as well as integrating these standalone devices into CIM as FA systems. Our mission is to fully utilize the technological capabilities we have accumulated so far and to deliver products and devices that will delight our customers more than ever before. In the future, we aim to be a one-of-a-kind company that consistently demonstrates originality in the ever-advancing field of information and communication technology.
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