Evaluating the interior of semiconductor products! We are focusing on "optimizing inspections" and "building inspection know-how" for our customers. Supporting 5G products!
The ultrasonic digital imaging diagnostic device "InsightScan IS-350" is a device that evaluates the internal structure of products non-destructively and without contact using ultrasound. It can detect internal defects in electronic components, metals, and welds non-destructively. [Reasons to Choose Insight] ■ "Optimization" of inspections… We create devices tailored to your inspection target products. We accommodate various aspects such as scan size, tank depth, and selection of probes. ■ Customer support… Ultrasonic testing is a specialized technology. We assist in the training of your engineers even after delivery. We provide training after installation, new sample testing, selection of new probes, and support free of charge. We also assist when there are changes in personnel.
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basic information
**Overview** The IS-350 is a water immersion ultrasonic testing device. It allows for internal inspections without damaging the test subject. It can be used for a wide range of applications, from electronic components to metal materials. **Target Applications** - Detection and evaluation of internal defects in electronic components and semiconductor packages - Detection and evaluation of voids in bonding structures - Evaluation of metal materials **Features** - Expandability The IS-350 can be customized in both hardware and software according to customer requirements. It is capable of manufacturing appropriate devices based on the application. **Device Configuration** - Effective Scan Area - **Basic Configuration** 350×350 (mm) - **Options** Medium: 450×450 (mm) Large: 600×600 (mm) Other expansions are possible based on requests - Supported Frequency 250 kHz to 500 MHz - Mechanical Operation Accuracy 0.5 μm - Main Body Size 700W×750D×1300H (mm) (standard)
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Applications/Examples of results
◆ Detection and evaluation of internal defects in electronic components and semiconductor packages Delamination of bonded wafers Voids and delamination in CSP and flip chip underfills Evaluation of plastic packages Interlayer delamination of ceramic capacitors Evaluation of power semiconductors Composite materials such as CFRP and GFRP Other internal defect inspection and reliability evaluation of electronic components ◆ Detection and evaluation of voids in bonding structures Voids in electrostatic chuck bonding Voids in bonding of target materials Voids at joints of dissimilar materials Evaluation of adhesive materials ◆ Evaluation of metallic materials Detection of non-metallic inclusions Detection of cracks and voids Evaluation of welds Nonlinear ultrasonic methods
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We are a cutting-edge company in the industry with a bidirectional business approach that develops and supplies ultrasonic data collection, analysis, and image processing systems for the global industrial non-destructive testing sector, microelectronics sector, and academic research sector. We also introduce advanced and innovative non-destructive diagnostic technologies from companies around the world to the domestic market ahead of others, assisting in market establishment.
