Manufacturing is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.
We can manufacture from 3 layers to 8 layers. Typically, with multilayer flexible circuits, the more layers there are, the thicker the board becomes, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.
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basic information
【Features】 - Uses NC machines for coverlay processing and outline processing without molds - Achieves processing accuracy of ±0.05mm through unique know-how - Processed surfaces have a finish comparable to mold processing - Capable of producing 3 to 8 layers - Typically, in multilayer flex circuits, as the number of layers increases, the thickness also increases, which compromises the bendability characteristic of flex substrates; however, by using thin materials and thin copper foil, bendability is maintained ● For more details, please contact us or refer to the catalog.
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Company information
In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to meet these demands by producing a wide variety of substrates in a short lead time through in-house integrated production. "Good products faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.
