This is a method of forming a build-up layer on top of a core substrate.
The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.
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【Features】 ○ A method of forming build-up layers on a core substrate ○ Connection between the core substrate and the build-up layers is done using laser vias ○ Allows for higher density wiring ○ Currently supports up to 2-layer build (two layers of build-up layers above and below) ○ Supports stack vias and filled vias as well ○ Proven track record of manufacturing rigid-flex substrates and multilayer flex substrates using the build-up method ● For more details, please contact us or refer to the catalog.
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In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to meet these demands by producing a wide variety of substrates in a short lead time through in-house integrated production. "Good products faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.
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