A rich lineup. Widely adopted for LED lighting and automotive applications.
This is a highly thermally conductive printed circuit board material designed to accommodate components that emit high heat during operation, such as high-brightness LEDs and power semiconductors. It has been on the market for 20 years, and the lineup has been enriched, receiving many adoptions.
Inquire About This Product
basic information
This is a printed circuit board material that has a layer of insulating resin with high thermal conductivity arranged on the surface of an aluminum plate, with copper foil for circuit formation applied on top. In response to customer requests, we have developed a variety of insulating resins tailored to different applications, resulting in a rich lineup.
Price range
Delivery Time
Applications/Examples of results
Printed circuit board materials for mounting components that generate high heat during operation, such as high-brightness LED substrates and power semiconductor substrates.
Detailed information
-
AC-7900. Thermal conductivity of the insulation layer = 1W/mK. The insulation layer reinforced with glass fabric can be made as thin as 0.06mm, allowing for a reduction in thermal resistance, which is expected to provide better heat dissipation than the catalog values. The insulation layer is white and designed to minimize discoloration due to ultraviolet light and heat.
-
AC-7004C. Thermal conductivity of the insulation layer = 3W/mK. This is a long-selling product that has been refined over 20 years based on feedback from our customers.
-
AC-7302. Thermal conductivity of the insulating layer = 2 W/mK. A solder crack prevention product with a very soft insulating layer even after thermal curing. The soft insulating layer absorbs the thermal expansion (contraction) of the aluminum plate, reducing the stress on the solder joints of surface-mounted components.
-
AC-7303. Thermal conductivity of the insulating layer = 3 W/mK. A solder crack prevention product with a very soft insulating layer even after thermal curing. The soft insulating layer absorbs the thermal expansion (contraction) of the aluminum plate, reducing the stress on the solder joints of surface-mounted components.
-
AC-7200TY. Thermal conductivity of the insulation layer = 5W/mK. It has been widely adopted for high-brightness LED lighting applications.
-
AC-7210N. Thermal conductivity of the insulation layer = 10 W/mK. The insulation layer also has high heat resistance with a Tg of 300°C. We are considering its adoption around SiC power semiconductors.
-
Processed products made from aluminum base substrate materials (demo products). For explanation purposes, the insulating resin layer arranged on the surface of the aluminum plate has been removed to expose the underlying aluminum plate. Cooperation: Techno Electronics Co., Ltd.
Line up（6）
| Model number | overview |
|---|---|
| AC-7900 | Thermal conductivity of the insulation layer = 1W/mK. |
| AC-7004C | Thermal conductivity of the insulation layer = 3W/mK |
| AC-7302 | Thermal conductivity of the insulation layer = 2W/mK |
| AC-7303 | Thermal conductivity of the insulation layer = 3W/mK |
| AC-7200TY | Thermal conductivity of the insulation layer = 5W/mK |
| AC-7210N | Thermal conductivity of the insulation layer = 10W/mK |
catalog（2）
Download All Catalogs
Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
![[Case Study on the Use of Conductive Diamond] Anodizing of Aluminum Alloys](https://image.mono.ipros.com/public/product/image/2111902/IPROS12262030867861008050.png?w=280&h=280)