Laser light oblique incidence interferometer compatible with a maximum φ200mm; image analysis using phase shift method.
This is a digital measurement of various samples by analyzing interference fringes using a phase shift method with a laser light oblique incidence interferometer. It is used in R&D and mass production lines to improve quality for semiconductor wafers (GaN, SiC, and sapphire) and magnetic disks for hard disk drives (aluminum and glass).
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basic information
【Features】 - Rapid acquisition of measurement data through full-field analysis using laser illumination. - Capable of measuring samples such as wafers (silicon, compound, oxide, glass), metal pieces, disks (aluminum, glass), and mechanical parts. - Our proprietary phase shift analysis that supports multiple interference fringes. - Equipped with a unique interference adjustment mechanism that reduces back-side interference when measuring transparent samples. - Capable of high-precision analysis of back-side interference fringes (thickness variations) for transparent samples. - Easy operation through system control with a dedicated analysis device (Windows OS based). - No calibration required by the customer. - A wide range of options available.
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It contributes to quality improvement in R&D and mass production lines for semiconductor wafers (GaN, SiC, and sapphire) and magnetic disks for hard disk drives (aluminum and glass).
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Company information
Since its founding in 1971, Nidek has continued to create distinctive technologies and products by merging optical technology and electronic technology. (In 2026, we celebrated our 55th anniversary.) Currently, we are conducting business activities on a global scale, focusing on three main areas: the medical field, the eyewear equipment field, and the coating field. This site introduces the "coating field."
