Customizable in size, adsorption pattern, and temperature!
We uniformly heat extremely thin workpieces such as wafers and glass substrates. The maximum temperature that can be achieved is 300°C. The workpieces are fixed by vacuum suction, so there is no stress applied to them from the fixation. The plate is made of aluminum alloy, treated with black anodizing, and features guide markings through laser marking. Precise temperature control is also possible with the MSA digital temperature controller. OEM support is available as well. ● For more details, please download the catalog or contact us.
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basic information
【Specifications】 ○ Temperature control range: Room temperature to 300℃ ○ Chuck surface size: 200×200mm ○ Temperature accuracy: ±1.0% ● For more details, please download the catalog or contact us.
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For more details, please contact us.
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Wafer Hot Chuck
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We invite production engineers and manufacturing staff to visit the MSA Factory website, which provides strong support!