Thin material for printed circuit boards for package substrates
Rishorite Copper-Clad Laminate for Printed Circuit Boards CS-3305
It suppresses warping during reflow.
- The bending elastic modulus at high temperatures is very high, reducing warping during reflow. - The handling properties are good when processing thin substrates. - It is a high heat-resistant material while also exhibiting excellent moisture-resistant solder heat resistance. - The composition of the insulating layer is uniform, resulting in good laser processing capabilities. - It is an environmentally friendly substrate material that is halogen-free, phosphorus-free, and free of metal oxides.
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basic information
This is a substrate material for directly mounting semiconductor devices. It is a resin-based substrate material that can withstand the hot air of reflow soldering even in thin forms like 0.06mm, and due to its low warpage, it contributes to improved mounting reliability.
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Applications/Examples of results
Printed circuit board materials for thin film semiconductor package substrates
Detailed information
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A semiconductor package substrate is a substrate for directly mounting semiconductor devices, as indicated in red in the illustration. The device and substrate are joined by melting solder balls with hot air (reflow soldering). Since the thickness is about 0.06mm, warping due to the hot air during the reflow process can lead to soldering defects. Therefore, CS-3305 is finished with substrate materials that do not warp, even when thin.
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It suppresses "bloating" and "peeling" between the built-up layers. By incorporating additives to impart heat resistance to the resin, the bonding points (cross-linking points) between molecules increase. When the number of cross-linking points increases, the gaps between molecules (free volume) also increase, allowing more moisture to enter. When this moisture rapidly expands due to the hot air of reflow, it can cause "bloating" and "peeling" between the built-up layers, leading to connection failures, as illustrated. CS-3305 is formulated to be less absorbent, ensuring excellent connection reliability.
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The laser machinability is good. Since printed circuit board materials are composites of copper foil, resin, and glass cloth, adjusting the laser output when drilling holes with a laser can be quite challenging. For example, if the output is set to match the glass cloth, the resin may be excessively processed... and so on (illustration). The CS-3305 has made the composition of the insulating layer more uniform, resulting in a substrate material with good laser machinability.
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CS-3305 Processing Sample Provided by: Techno Electronics Co., Ltd.
Line up（1）
| Model number | overview |
|---|---|
| CS-3305 | Double-sided copper-clad laminate |
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
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