Shear area over 70% for SCM435 with a thickness of 3mm using progressive die stamping!
- Shear surface of the hole is over 70% - Tolerance of the hole is ±0.05 - Coaxiality between holes is 0.3 - The R of the bending part is 1 to 1.5 (no strike) with 8.0±0.2 - Hardening and plating are performed in subsequent processes. In progressive stamping, we efficiently process using 60t, 80t, 110t, and 150t servos. Please feel free to consult us from prototype to mass production, even from the design stage. We will propose the best processing method from various aspects. There are also various other processing methods available. - For more details, please contact us or download the catalog.
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basic information
■Material: SCM435 (Chromoly) ■Thickness: t3.0
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We have a track record of delivering several types of weak electrical components.
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■ Recently, there has been a surge in inquiries about busbars (bus bars, copper bars). We have experience processing copper materials up to 20mm thick and are well-versed in electrical components, ready to take on new challenges. We can also procure hard-to-find copper materials such as C1100 and C1020 from domestic manufacturers. Please feel free to reach out to us. ■ Before mass production overseas, we will start from prototyping to mass production setup domestically. If the parent company is based in Japan, there is no need to travel overseas for prototype inspections, allowing for speedy on-site confirmation and meetings. Overseas, the quality and skills required are still not at the desired level during the prototyping stage, leading to ongoing troubles once mass production begins. By confirming everything until stable mass production processing can be achieved in Japan, we can transfer the molds overseas much more quickly. Additionally, since communication can be conducted in Japanese, meetings between engineers proceed very smoothly, allowing for thorough development during the crucial initial phase of prototyping and setup. (English support is also available), providing many advantages.
