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  6. CZ wafer film deposition processing

CZ wafer film deposition processing

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last updated:Jul 29, 2025

エナテック 東京本社
エナテック 東京本社
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Film deposition is possible on wafers ranging from 2 inches to 12 inches.

Enatec Co., Ltd.'s CZ wafer film deposition processing can accommodate film deposition on wafers ranging from 2 inches to 450 mm, depending on the type of film. Oxide films: thermal oxidation, RTO, LP-TEOS, HDP-USG, P-TEOS, PSG, BPSG, BSG, LP-CVD, PE-CVD Nitride films: HCD-SiN, DCS-SiN, P-SiN, LP-SiN, LP-CVD, PE-CVD Metal films: TaN, Ta, Cu, Al, AlN, Al-Si, Al-Si-Cu, Ni, W, W-Si-Cu Others: Poly-Si, a-Si, SiC, Low-k (SiOC-based, organic chemistry-based), graphene films, graphite * Depending on the type of film, such as SiO2, SiN, SiON, we can accommodate from one piece. * We can also handle Ti, Cu, Cr, Ni, etc., through sputter deposition. * Resist coating/exposure/etching can be accommodated from 4 inches to 12 inches. * We can also provide consistent support for wafers with test patterns (from 6 inches to 12 inches) based on specifications. * We accept exposure/etching with provided reticles (8 inches and 12 inches). For more details, please contact us.

    WaferOther semiconductorsProcessing Contract
DSCN0058-2.jpg

CZ wafer film deposition processing

DSCN0058-2.jpg
DSCN0058-2.jpg
  • Related Link - http://www.enatek.co.jp/pfilmservice.html
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【Features】 ○ Film deposition is possible on wafers ranging from 2 inches to 450 mm, depending on the film type. ○ Supports wafers with test patterns (6 inches to 12 inches). ○ Exposure/etching is also supported with provided reticles (8 inches and 12 inches). ○ Resist coating/exposure/etching can be accommodated for sizes from 4 inches to 12 inches. ○ Back grinder: diameter from 5 inches to 12 inches. ○ Dicing: diameter from 5 inches to 12 inches. 【Compatible Film Types for 12 Inches】 ○ Oxide films: thermal oxide, RTO, LP-TEOS, HDP-USG, P-TEOS, PSG, BPSG. ○ Nitride films: DCS-SiN, P-SiN, LP-SiN. ○ Metal films: TaN, Ta, Cu, Al, Al-Si, Al-Si-Cu, Ni, W, W-Si-Cu. ○ Others: Poly-Si, A-Si, SiC, Low-k (SiOC-based, organic chemistry-based). ● For more details, please contact us.

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Enatec Inc. - Product Catalog

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エナテック

エナテック 東京本社

Electronic Components and Semiconductors

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Enatech handles a wide range of silicon wafer-related products and responds quickly and accurately to customer requests. With over 40 years since its establishment, we have supported a part of the semiconductor industry, primarily in the Si field. Through cooperation with silicon manufacturers and processing companies both domestically and internationally, we provide a stable supply of silicon materials not only to Japan but also to overseas markets. We mainly sell evaluation test wafers and film deposition wafers to semiconductor and solar cell manufacturers (as well as contract processing such as regeneration), and in the field of dummy wafers, we have two warehouses for Si sorting processes in Japan, allowing us to introduce various types of wafers to meet customer needs. In addition to CZ silicon wafers, we also handle FZ silicon wafers, SOI wafers, diffusion wafers, SiGe, GaAs, InP, sapphire, germanium, SiC wafers, used equipment for semiconductors, ferrite cores, iron oxide, high-purity chemicals, and more.

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