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  6. CZ wafers, epitaxial contract processing, SiGe epitaxial wafers, and others.

CZ wafers, epitaxial contract processing, SiGe epitaxial wafers, and others.

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last updated:Jul 29, 2025

エナテック 東京本社
エナテック 東京本社
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We can accommodate small lots. We will do our best to handle special epoxies and multi-layer epoxies as well.

"Epi-Wafer" 1. It is used for discrete devices and IC power devices. * Diameter: 100-200 mm * Epi layer dopants: Boron, Phosphorous * Epi layer resistance value: 0.01-500 Ω/cm * Epi thickness: 1-150 um * Stacking fault: Below 10 /cm2 * Thickness Uniformity: 1% * Resistivity Uniformity: 2.5% (resistance 0.1-20 Ohm.cm) / 3% (resistance >20 Ohm.cm) * Minimum of 25 pieces "Epi Contract Processing" We can also accommodate wafers with high Epi resistance exceeding 1000 ohm cm, or wafers with thick Epi layers. Multi-layer Epi deposition can also be supported depending on specifications. Features - Small lots (from a few pieces to 25 pieces) are possible for experimental use - Sub-wafers can be specified (customers can also provide sub-wafers) - Epi thickness tolerance: within 6-10% (varies with Epi thickness) - Resistance uniformity tolerance: within 5-15% (varies with resistance)

    WaferOther semiconductorsProcessing Contract
DSCN0058-2.jpg

CZ wafers, epitaxial contract processing, SiGe epitaxial wafers, and others.

DSCN0058-2.jpg
DSCN0058-2.jpg
  • Related Link - https://www.enatek.co.jp/pepiservice.html
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【Features】 ○ Available in small lots (25 pieces) for experimental use ○ Sub-wafers can also be specified ○ Epitaxial thickness tolerance: within 6-10% (varies with epitaxial thickness) ○ Resistance uniformity tolerance: within 5-15% (varies with resistance) 【Epitaxial Contract Processing】 ○ Diameter: 76, 100, 125, 150mm ○ Dopants: Boron, Phosphine, Arsenic ○ Epitaxial resistivity: 0.1-800 ohm cm ○ Epitaxial thickness: 3-150μ “Multilayer EPI Wafer Processing” * Material supply is also possible. * Processing is available from a few pieces. * It is possible to stack several layers such as Si/GaN/InP. * The presence or absence of buffer layers may vary depending on specifications such as film thickness, so please inquire. “SiGe Epi Wafer” * Various options are available depending on concentration and film thickness. * Diameters up to a maximum of 8 inches can be accommodated. * Ge concentration: Please specify your desired concentration, such as 20%, 60%, etc. * Si or SOI can also be used as substrates. * Multilayer films can also be accommodated. ● For more details, please contact us.

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Enatec Inc. - Product Catalog

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エナテック

エナテック 東京本社

Electronic Components and Semiconductors

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Enatech handles a wide range of silicon wafer-related products and responds quickly and accurately to customer requests. With over 40 years since its establishment, we have supported a part of the semiconductor industry, primarily in the Si field. Through cooperation with silicon manufacturers and processing companies both domestically and internationally, we provide a stable supply of silicon materials not only to Japan but also to overseas markets. We mainly sell evaluation test wafers and film deposition wafers to semiconductor and solar cell manufacturers (as well as contract processing such as regeneration), and in the field of dummy wafers, we have two warehouses for Si sorting processes in Japan, allowing us to introduce various types of wafers to meet customer needs. In addition to CZ silicon wafers, we also handle FZ silicon wafers, SOI wafers, diffusion wafers, SiGe, GaAs, InP, sapphire, germanium, SiC wafers, used equipment for semiconductors, ferrite cores, iron oxide, high-purity chemicals, and more.

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