Low dielectric constant & low dielectric loss tangent printed circuit board materials
Copper-clad laminate for Risho Light print wiring board
It is a printed circuit board material for high-capacity and high-speed communication devices such as base station antennas and high-speed servers and routers.
With the spread of smartphones and tablet devices, the equipment that makes up broadband systems is required to process large amounts of data at high speeds. Additionally, to enhance "connectivity" and expand coverage areas, the installation and upgrading of base stations are being advanced. In response to this, Rishou Industry has prepared printed circuit board materials that have a fast signal propagation speed (low dielectric constant) and a function to minimize transmission loss (low dielectric loss tangent).
Inquire About This Product
basic information
At Richang Industrial, we offer glass cloth-based PPE resin (polyphenylene ether) copper-clad laminates as materials for low dielectric constant and low dielectric loss tangent printed circuit boards. We also have a type that further enhances transmission characteristics by applying VLP (Very Low Profile) copper foil to the surface of this PPE material. Additionally, we offer a halogen-free glass epoxy type.
Price range
Delivery Time
Applications/Examples of results
High-speed servers and routers, GPS antennas, downconverters, in-vehicle devices such as ETC, digital broadcasting equipment, semiconductor testing equipment, mobile phone base station-related (antennas and power amplifiers), and more. There are many adoption achievements with antenna substrates.
Detailed information
-
CS-3376B 〇Application For high multilayer use (for multilayer production) High-speed servers and routers 〇Features ε=3.4 / tanδ=0.004 (1GHz) Glass transition temperature = 220℃ (DMA) Excellent thickness precision. Almost no powder drop from the prepreg, contributing to reduced defects.
-
CS-3376C 〇Application Double-sided board application Related to mobile phone base stations (antennas, amplifiers) GPS antennas, etc. 〇Features ε=3.3/tanδ=0.003 (1GHz) Glass transition temperature = 185℃ (DMA) Excellent board thickness accuracy.
-
CS-3376CN 〇Application Double-sided board applications Related to mobile phone base stations (antennas, amplifiers) GPS antennas, etc. 〇Features ε=3.1/tanδ=0.001 (1GHz) Glass transition temperature = 185℃ (DMA) Excellent board thickness accuracy. *There is also a type with VLP (Very Low Profile) copper foil, which further enhances transmission characteristics.
-
CS-3376CX 〇 Application Double-sided board applications Mobile phone base station related (antenna, amplifier) GPS antenna Downconverter, etc. 〇 Features ε=3.2/tanδ=0.003 (1GHz) Glass transition temperature = 185℃ (DMA) Excellent board thickness accuracy. * The part number for the type with VLP (Very Low Profile) copper foil, which further enhances transmission characteristics, is CS-3376CW.
-
CS-3387S 〇 Applications Multilayer board applications Mobile phone base station related (antennas, amplifiers) Optical communication applications and others 〇 Features It is a halogen-free low dielectric constant substrate material made from epoxy resin. ε=3.9/tanδ=0.008 (1GHz) The CTE (α1) is low at 40ppm/℃, providing excellent reliability for through holes.
-
CS-3376G 〇Application Related to mobile phone base stations (antennas, amplifiers, etc.) 〇Features ε=3.1/tanδ=0.003 Glass transition temperature = 200℃ (DMA) By using E-glass as the substrate, we have achieved cost reduction.
-
CS-3388 〇Applications Double-sided board applications Mobile phone base station related (antennas, amplifiers, etc.) Down converters 〇Features ε=3.5/tanδ=0.003 Glass transition temperature = 185℃ (DMA) Due to its low water absorption rate, this material exhibits minimal changes in dielectric properties due to environmental variations. It has excellent handling properties, allowing for thinner substrates. It offers excellent cost performance.
Line up（7）
| Model number | overview |
|---|---|
| CS-3376B | ε=3.4. PPE resin printed circuit board material. It is a multilayer printed circuit board material. |
| CS-3376C | ε=3.3. PPE resin printed circuit board material |
| CS-3376CN | ε=3.1. PPE resin printed circuit board material |
| CS-3376CX | ε=3.2. PPE resin printed circuit board material |
| CS-3387S | ε=3.9. Halogen-free epoxy resin printed circuit board material. It is a multilayer printed circuit board material. |
| CS-3376G | ε=3.1. PPE resin printed circuit board material |
| CS-3388 | ε=3.5. PPE resin printed circuit board material |
catalog（3）
Download All Catalogs
Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
![Low-pressure sealing thermosetting dry molding material Bioglass [Developed product]](https://image.mono.ipros.com/public/product/image/4c5/2000521401/IPROS64660083526804762465.jpeg?w=280&h=280)