Compatible with 6-inch and 8-inch wafers! Plasma processing equipment using a parallel plate method.
The WLP600S is a plasma processing device using a parallel plate method. It supports 6-inch and 8-inch wafers, achieving low cost and space-saving design. The two types of plasma modes, DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, can be switched using only the controls on the panel, making it suitable for various applications such as etching polyimide-based resins and surface modification of photoresists. 【Features】 ○ Easy plasma mode switching ○ High-speed responsiveness ○ Space-efficient footprint ○ Compatibility with a wide variety of processes ○ High customization options For more details, please contact us or download the catalog.
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basic information
【Specifications】 ○Processing Method: Parallel Plate Plasma Excitation Method (DP/RIE switchable) ○Processing Chamber: Made of AL (Single Chamber) ○RF Power Supply: 600W 13.56MHz Auto Tuning ○Processing Gases →O2: 1000 SCCM →CF4: 500 SCCM →1 additional line can be added (optional) ○Purge Gas: N2 ○Throughput: 3000 wafers/400 hours (when etching polyimide film at 1μm) ○Processing Steps: 3 steps, 10 recipes ○Wafer Size: Compatible with 6-inch and 8-inch ○Wafer Transport Method →Vertical operation cassette elevator (compatible with 6-inch and 8-inch) →Horizontal and rotary operation single-finger suction clean robot ○Main Body Dimensions: W600 × D1500 × H1850 ○Main Body Weight: 650kg ●For more details, please contact us or download the catalog.
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Esclafte Co., Ltd. is a company where experienced expert engineers shape our customers' requests and contribute to the progress and development of society through the supply of excellent products.
