Printed circuit board material for semiconductor package substrates CS-3305A

basic information

- The use of general-purpose E-glass as the substrate results in excellent cost performance. - The coefficient of thermal expansion (CTE) is almost equivalent to that of IC chips at 6 ppm/K. - The bending modulus during heating is very high, reducing warping during reflow. - The handling characteristics during thin material processing are good. - It is a high-heat-resistant material with a Tg of over 300°C, while also having low water absorption, which enhances mounting reliability and insulation reliability. - It is a halogen-free and phosphorus-free environmentally friendly material.

Price range

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Applications/Examples of results

〇 Semiconductor-mounted substrates 〇 Substrates for automotive equipment 〇 Various module substrates Additionally, circuit boards that require low warpage, high heat resistance, and high reliability.

Detailed information

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  Image of Warpage Mitigation If the difference between the thermal expansion coefficient of the IC chip and that of the substrate material is large, warpage can occur during the reflow process (soldering), leading to connection failures. To suppress warpage... 1. Bring the thermal expansion coefficient (CTE) of the substrate material closer to that of the IC chip. 2. Increase the modulus (elasticity) of the substrate material when it is at high temperatures. ...are considered.

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  The thermal expansion coefficient of the CS-3305A TMA chart is approximately 6 ppm/K, which is comparable to that of IC chips, so it is expected to reduce warping during heating processes such as reflow soldering.

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  DMA chart CS-3305A has a high elastic modulus at elevated temperatures, which is expected to reduce warping during high-temperature processes such as reflow soldering.