Measuring the warping of the substrate during heating using shadow moiré measurement! ◆Warping data obtained in about 2 seconds per point! ◆Achieving a resolution of 0.5 microns!
TherMoire AXP 3.0 utilizes shadow moiré measurement technology to enable surface analysis with a variety of optional modules. It visualizes the surface shape of samples in user-specified temperature profile environments. In addition to measuring warping during heating, optional features are available for analyzing surface behavior in sub-zero temperature environments and calculating CTE values. Furthermore, the design ensures high temperature uniformity due to the top and bottom heating. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ Maximum measurement field of view: 375×375mm (during shadow moiré) ○ Analysis under thermal conditions that replicate the reflow process (heating temperature: room temperature to 300℃) ○ Warpage data acquisition time: approximately 2 seconds per point ○ Simultaneous measurement of multiple samples is possible 〇 Achieves a resolution of 0.5 microns 〇 Measurement can be performed at the same resolution regardless of the measurement field of view (no lens switching required) ● For more details, please contact us or download the catalog.
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Company information
Starting with printed circuit boards, we provide cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment for major electronic components such as semiconductors, LCDs, and PDPs, as well as inspection and analysis equipment. Although we operate as a trading company, we leverage our many years of experience in resist coating as a "trading company that can speak about technology" to offer optimal solutions to various customers, and we will continue to contribute to the Japanese electronic component industry.
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