Introducing a high-performance film thickness measurement device that allows for the "easy" and "quick" measurement of various metal oxide films and metal films using the continuous electrochemical reduction method!
Therma Precision Co., Ltd. provides cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment and inspection and analysis equipment for major electronic components such as printed circuit boards, semiconductors, LCDs, and PDPs. 【About the Oxide and Metal Film Thickness Measurement Device】 The PC-M1 is a device that easily measures the thickness of thin film oxide and thin film metal using a continuous electrochemical reduction method. 【Metals for Oxide Measurement】 [About Oxide Measurement] ○ Copper: Cu2O, CuO, Cu2S ○ Tin: SnO, SnO2 ○ Silver: Ag2O, AgCl, Ag2SO4, Ag2S 〇 For other materials (such as aluminum), please consult us. Measurements are taken in various Å (angstrom) units. 【Comparison with Other Analyzers】 PC-M1 vs. Other Analyzers Measurement Time: Several hundred seconds vs. several hours Identification of Oxide Types: Possible vs. Difficult Measurement of Intermetallic Compounds: Possible vs. Difficult Equipment Cost: Within tens of millions vs. thousands to hundreds of millions Ease of Handling: Easy vs. Difficult Minimum Measurement Area: mm² vs. μm² For more details, please contact us or download the catalog.
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【Metal Film Thickness Measurement Possible Metals】 [About Metal Film Thickness Measurement] ○ Gold : Min 40Å (0.004μm)～ ○ Copper : Min 200Å (0.020μm)～ ○ Nickel : Min 200Å (0.020μm)～ ○ Silver : Min 200Å (0.020μm)～ ○ Tin : Min 200Å (0.020μm)～ 【Applications】 - Analysis of connection failures due to mounting - Degree of oxide film growth during reflow temperature rise associated with lead-free processes - Analysis of tin-copper alloy growth - Analysis of S (sulfide) not obtainable by other analyzers - Confirmation of the presence of organic protective films 【Analysis Items】 - Lead frames - Pre-mount substrates - Post-mount substrates (NG products) - Wafers - BGA (100μm balls) - Bonding wires etc. 【Features】 - Non-destructive type - Short measurement time - No restrictions on usage environment - No safety hazards in handling - Compliant with Mil Spec 55110E 【Others】 〇 Parameters for aluminum oxide films and others are under development. ● For more details, please contact us or download the catalog.
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Starting with printed circuit boards, we provide cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment for major electronic components such as semiconductors, LCDs, and PDPs, as well as inspection and analysis equipment. Although we operate as a trading company, we leverage our many years of experience in resist coating as a "trading company that can speak about technology" to offer optimal solutions to various customers, and we will continue to contribute to the Japanese electronic component industry.