Heating processes and material evaluation under vacuum atmosphere and low oxygen concentration atmosphere for metals, wafers, etc.
The "PH-224D model" vacuum hot plate chamber is ideal for heating processes and material evaluation under vacuum conditions and low oxygen concentration atmospheres for metals, wafers, and more. 【Specifications Customization】 ○ Temperature control range: Room temperature to 200℃ ○ Plate size: 200×200mm ○ Pressure range: -100KPa (vacuum) to 0.02MPa (when filled with N2 gas) For more details, please contact us or download the catalog.
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basic information
【Features】 ○ Maximum temperature: 200°C compatible → Vacuum hot plate chamber, batch furnace ○ Compact, tabletop batch furnace type, ideal for small quantities and research and development ○ Chamber and plate are integrated to reduce the number of parts and lower costs ○ The temperature controller, with a dedicated type, can obtain necessary data for process verification (analog output) ○ Valve operation: automatic response (programmable according to the recipe) ● For more details, please contact us or download the catalog.
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【Purpose】 ○ Heating processes and material evaluation in a vacuum atmosphere and low oxygen concentration atmosphere for metals, wafers, etc. ● For more details, please contact us or download the catalog.
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