You can build a highly functional processing system without waste.
The multi-layout multifunctional wrapping system "Trinity-Y" is a device developed to accommodate next-generation materials such as wide-gap semiconductors. It allows for the flexible selection of mechanisms optimal for various new materials, consolidating these functions into a single unit to achieve space-saving design and build a highly functional processing system without waste. For more details, please contact us or download the catalog.
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basic information
【Specifications】 [Vertical Grinding Device] ○ Vacuum Chuck Size: φ250, SUS ○ Grinding Wheel Size: φ200, SUS ○ Grinding Wheel Speed: Max 2,000rpm ○ Workpiece Speed: Max 400rpm [Lap Mechanism] ○ Polishing Plate Outer Diameter: φ380mm ○ Plate Speed: Max 100rpm ○ Pressing Head: φ140* 1 Axis ○ Facing Method: Hydraulic Slider [Scrub Mechanism] ○ Chuck Method: Pin Type ○ Speed: Max 300rpm ○ Wafer Size: Compatible with φ4-8″ Wafers ○ Brush Material: PVA Sponge φ30mm ● For more details, please contact us or download the catalog.
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Company information
Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.