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  4. Semiconductor Manufacturing Equipment
  5. Other semiconductor manufacturing equipment
  6. Semi-automatic ACF bonding device LS-02

Semi-automatic ACF bonding device LS-02

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LS-02

last updated:Oct 08, 2014

大橋製作所 機器事業部
大橋製作所 機器事業部
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Continuous pasting to multiple works, smoothly transitioning to the next process according to the carrier method.

This is an ideal device for mass production, allowing multiple workpieces to be continuously pasted with ACF. Additionally, it can handle workpieces with a common carrier for subsequent processes (mounting, thermal pressing), enabling an efficient line configuration from pasting to thermal pressing.

    Other semiconductor manufacturing equipmentOther mounting machinesOther assembly machines
LS-02.jpg

Semi-automatic ACF bonding device LS-02

LS-02.jpg
LS-02.jpg
  • Related Link - http://www.ohashi-engineering.co.jp/products3/inde…

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basic information

This is a device for continuously applying ACF to multiple workpieces or multiple locations on a workpiece. The workpiece is set on a dedicated carrier, and ACF is applied continuously. [Specifications excerpt] - Carrier size: Max. 250(W) x 400(D)mm - Number of ACF applications: Max. 100 - ACF application length: Max. 30mm - ACF width: Max. 10mm

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Applications/Examples of results

Corresponding to the following processes: FOB/FOG/FOF/COB/COG/COF

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Semi-Automatic ACF Bonding Device LS-02Z

Semi-Automatic ACF Bonding Device LS-02Z

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大橋製作所

大橋製作所 機器事業部

Industrial Machinery

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Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.

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The related categories of Other semiconductor manufacturing equipment

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