Seven cutting-edge logic devices manufactured by Intel, TSMC, and Samsung.
This report is a process comparison of seven advanced 20nm-class logic devices manufactured by Intel, TSMC, and Samsung. It discusses the structures and materials used in the manufacturing of core logic transistors, I/O transistors, metallization, and SRAM layout. [Features] - Understanding key design and manufacturing innovations - Informed decision-making for technology resource investments - Support for IP activities through valuable "Evidence of Use (EoU)" information For more details, please contact us or download the catalog.
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【Table of Contents】 ○ Package and Die ○ Peripheral NMOS, PMOS, I/O Transistors ○ Metallization ○ SRAM Cell Architecture 5 Major Findings ● For more details, please contact us or download the catalog.
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