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  6. Ultrasonic Wire Bonder REBO-9

Ultrasonic Wire Bonder REBO-9

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REBO-9

last updated:Aug 19, 2019

超音波工業
超音波工業
  • Official site

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

    Other semiconductors
超音波ワイヤボンダ:サイズ変更.jpg

Ultrasonic Wire Bonder REBO-9

超音波ワイヤボンダ:サイズ変更.jpg
超音波ワイヤボンダ:サイズ変更.jpg
  • Related Link - https://www.cho-onpa.co.jp/product/bonder/auto.htm…

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Introducing the REBO-9, a new product in the REBO series equipped with new features. 【New Features】 ◇ A new type of oscillator that supports all frequencies in the lineup with a single oscillator ◇ Automatic collapse width confirmation function that measures and saves the collapse width after bonding ◇ Multi-point simultaneous recognition function ◇ Weight reduction of the rotary section ◇ Speeding up of XYZ drive ◇ Touch panel operation section ◇ High-speed startup with SSD installation

Price range

P7

Delivery Time

Please contact us for details

Applications/Examples of results

◇Semiconductor Power Module ◇SAW Device ◇High-Frequency Module

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Rotary Head Bonder REBO-9

Rotary Head Bonder REBO-9

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Rotary Head Bonder REBO-9T

Rotary Head Bonder REBO-9T

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Rotary Head Bonder REBO-9W

Rotary Head Bonder REBO-9W

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Company information

超音波工業

超音波工業

Industrial Electrical Equipment

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Since our founding, we at Ultrasonic Industry have been engaged in technology-driven management by combining our core ultrasonic technology with electronics and, further, mechatronics technology. We have received generous evaluations of our technological and product development capabilities from many, and we sincerely thank you for your support. In today's market, which is diversifying and where product life cycles are becoming increasingly shorter, what is required of companies is high development capability and rapid responsiveness born from flexible thinking. To provide products with high performance at low cost, we will further enhance our internal and external networks and aim to be a nimble company. Moreover, Ultrasonic Industry will play its role as a leading company in the industry in the highly information-oriented era of the 21st century, enhancing the development and technical capabilities we have cultivated thus far, and further refining our creativity by leveraging the individuality of each employee as we move forward with renewed determination. In the future, we will actively expand our business in the semiconductor manufacturing sector, industrial equipment sector, and measurement equipment sector, while flexibly responding to the needs and seeds of society, and we are committed to contributing to the creation of a prosperous society. We sincerely ask for your continued guidance and support.

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