Design and assembly of production equipment [FA equipment, LCD and semiconductor manufacturing/testing equipment]

basic information

■Production Equipment Design (Manufacturing Equipment, Inspection Equipment) ●Features - Wide range of design including mechanisms, structures, and control systems - Design compliant with SEMI S2, S8, and CE marking standards - Design considering processing methods and equipment assembly (collaboration with processing and assembly departments) 《Production Equipment Design Achievements》 Semiconductor manufacturing equipment/inspection equipment LCD manufacturing equipment/inspection equipment Mechanical and control design for wafer and cassette transfer machines Loader/unloader equipment design Design for FOUP and SMIF compatibility Tooling design ●Design Technology 1. Mechanism Design and Proposal - Transport methods (robots, conveyors, etc.) - High-speed transport methods using precise positioning and clamping mechanisms 2. Structural Design - Enclosure design (sheet metal, steel frame, aluminum frame, interior and exterior) - Component and unit implementation design 3. Cleanliness Design (Assembly Environment: Clean Room Class 10,000, 1,000) - Cleanliness design within the equipment (airflow measures, local exhaust for sliding parts) 4. Vacuum Design (Low to Ultra High Vacuum) - Chamber and vacuum exhaust system design 5. Control Design - Wiring design for electrical equipment within the device - PLC control design - Control system design If you are considering the design and assembly of production equipment, please contact us.

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Applications/Examples of results

■ Areas of Expertise ◇ Control Panels ◇ Production Equipment (for production lines, FA devices/semiconductor manufacturing equipment/LCD manufacturing equipment, etc.) ◇ Analytical Instruments (control devices, medical devices, etc.) ◇ Financial Equipment (ATMs, stock control systems, etc.) ■ Assembly ◇ Unit assembly to equipment assembly of semiconductor/LCD manufacturing and inspection devices ◇ Assembly of transport robots for semiconductors/LCDs ◇ Assembly of various production and inspection devices ■ Design ◇ Mechanical design and control design of wafer/cassette transfer machines ◇ Design for FOUP and SMIF compatibility ◇ Design of various loader/unloader devices ◇ Design of various production and inspection devices ◇ Tooling design ■ Achievements ◇ Wafer/glass (LCD) handling UNIT equipment represented by semiconductor EEEM ◇ Various semiconductor/LCD inspection devices using customers' core technology (UNIT: theory) ◇ Electrical and power panel boxes and control racks installed in clean rooms ◇ Simple small shutter UNIT for operation inside vacuum chambers ◇ Resist stripping device using only pure water ◇ Ancillary devices for mask cleaning equipment ◇ SMIF POD opener device ◇ MEMS material testing machine (bending: deflection: creep: etc.)