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  6. High Frequency Noise Analysis "Electrostatic Noise (ESD) Analysis"

High Frequency Noise Analysis "Electrostatic Noise (ESD) Analysis"

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last updated:May 15, 2015

エム・イー・エル
エム・イー・エル
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Apply ESD noise signals between the absolute ground and the connector FG terminal.

Conducted electrostatic noise analysis on a 6-layer data recorder board. Observed the potential difference between the grounds of a BGA with multiple ground terminals. The difference in noise voltage with and without the bypass capacitors implemented on the board was minimal, showing little effect from the bypass capacitors. This phenomenon can be considered as a difference in common mode current flowing through each ground terminal. To analyze such phenomena, it is necessary to analyze the entire board in its component-mounted state. 【Features】 ○ Electrostatic noise analysis of a 6-layer board (100x50mm) ○ Applied ESD noise signal between absolute ground and connector FG terminal For more details, please contact us or download the catalog.

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02_esd.jpg

High Frequency Noise Analysis "Electrostatic Noise (ESD) Analysis"

02_esd.jpg
02_esd.jpg
  • Related Link - https://www.melinc.co.jp/sample/pcb.html

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【Features】 ○ Conducted electrostatic noise analysis on a 6-layer data recorder board ○ Observed potential differences between the grounds of a BGA with multiple ground pins ○ The difference in noise voltage with and without bypass capacitors implemented on the board is minimal, showing little effect of the bypass capacitors ○ This phenomenon can be considered as a difference in common mode currents flowing through each ground pin ○ To analyze such phenomena, it is necessary to analyze the entire board in its component-mounted state ● For more details, please contact us or download the catalog.

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エム・イー・エル

エム・イー・エル

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<Company Description> - Development and sales of the high-frequency and microwave circuit/electromagnetic field simulator "S-NAP Microwave Suite" - Development and sales of the embedded printed circuit board simulator "S-NAP PCB Suite"

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