Printed circuit board design adapted to semiconductor package forms with advancing narrow pitch.
We propose the optimal printed circuit board design and manufacturing based on the packages used.
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basic information
We will optimize printed circuit board manufacturing by leveraging our know-how in printed circuit board design that incorporates WLCSP and by coordinating with substrate manufacturing and component assembly.
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Applications/Examples of results
Examples of printed circuit board designs equipped with narrow pitch packages ● 0.37mm pitch, 30-layer board, build-up + IVH method ● 0.25mm pitch, 8-layer board, build-up method ● 0.15mm pitch, 8-layer board, build-up method
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
