Achieving high-speed and low-cost encapsulation and molding of electrical components and electronic substrates.
In the hot melt molding method, components and substrates are set in a mold, and "thermoplastic resin" is injected into the interior of the mold, then rapidly cooled to solidify. The hot melt molding device "JWS Extruder" developed by Nordson consists of three parts: a tank for heating and melting pelletized hot melt resin, an applicator for injecting liquid hot melt resin into the mold, and a workstation for setting the mold. This product can minimize thermal degradation of hot melt resin over time. 【Features】 ○ Extensive track record in the automotive sector and various industries ○ Appropriately responds to diverse demands ○ Maximizes the use of high-performance materials For more details, please contact us or download the catalog.
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【Features】 ○ The sealing and molding are integrated, resulting in extremely high productivity. ○ The curing time is extremely short, within 30 seconds. ○ No heating equipment is required, contributing to CO2 reduction. ○ Environmentally friendly with productivity 60 times higher. ○ No case is needed, allowing for design tailored to the shape of parts and substrates. ○ Minimal use of resin. ○ Helps in cost reduction. ● For more details, please contact us or download the catalog.
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Nordson Corporation, which has expanded its network to 56 locations worldwide, operates as one of the four major regional divisions in Japan, actively providing unique system development and services to meet the market needs for adhesives, coatings, and more for our customers.