Innovative hot melt molding technology

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last updated：Jul 03, 2015

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Achieving high-speed and low-cost encapsulation and molding of electrical components and electronic substrates.

In the hot melt molding method, components and substrates are set in a mold, and "thermoplastic resin" is injected into the interior of the mold, then rapidly cooled to solidify. The hot melt molding device "JWS Extruder" developed by Nordson consists of three parts: a tank for heating and melting pelletized hot melt resin, an applicator for injecting liquid hot melt resin into the mold, and a workstation for setting the mold. This product can minimize thermal degradation of hot melt resin over time. 【Features】 ○ Extensive track record in the automotive sector and various industries ○ Appropriately responds to diverse demands ○ Maximizes the use of high-performance materials For more details, please contact us or download the catalog.

Related Link - http://www.nordson.co.jp/

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【Features】 ○ The sealing and molding are integrated, resulting in extremely high productivity. ○ The curing time is extremely short, within 30 seconds. ○ No heating equipment is required, contributing to CO2 reduction. ○ Environmentally friendly with productivity 60 times higher. ○ No case is needed, allowing for design tailored to the shape of parts and substrates. ○ Minimal use of resin. ○ Helps in cost reduction. ● For more details, please contact us or download the catalog.