List of Molding Equipment products
- classification：Molding Equipment
1～37 item / All 37 items
We offer estimates in as little as half a day for the procurement of precision machined parts for manufacturing equipment and inspection equipment related to semiconductor manufacturing, as well as eq...
- Molding Equipment
[Design/Customization] Winding Machine
We only accepted customization and modification design of the equipment. Customer / Precision Machinery Parts Manufacturer End User / Electronic Equipment Manufacturer Request Details / Modification design using existing equipment Main Specifications Transporting small lithium-ion battery components / Cutting from transport fixtures Reel taping / Laser marking / Reel winding Equipment Dimensions / W3,500mm × D1,200mm × H1,000mm This time, we only undertook the mechanical and equipment design. We were responsible for the mechanical design of the work transport fixture supply section, the work cutting / extraction / feeding section, and the reel winding section. The customer handled parts procurement, assembly, and other aspects outside of mechanical design. We also accept design-only projects. We can flexibly respond to customer requests, whether for custom equipment or, as in this case, using existing equipment. Our greatest strength is our ability to provide a one-stop service for the entire process from design to installation in equipment and fixture manufacturing. Please feel free to share any concerns related to equipment and fixtures, such as transport, robotics, and production facilities.
Molding machine that maximizes productivity to the limit.
- Molding Equipment
We will provide suitable proposals for the packaging process design that you desire!
- Wafer processing/polishing equipment
- Molding Equipment
- Other semiconductor manufacturing equipment
Machining / Polishing
- CMP Equipment
- Molding Equipment
This is the world's first amorphous chrome plating that achieves approximately twice the hardness of hard chrome (Hv 1800) and high corrosion resistance due to its crack-free nature.
- Resin mold
- Molding Equipment
- Fuel system parts
365 days a year, 24 hours a day service system! We will rush to you whenever you need us.
- Molding Equipment
- Heating device
Aluminum precision machining / A5052 / Single item [Leave cost reduction to Philir Co., Ltd.]
- Molding Equipment
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Precision parts for semiconductor manufacturing equipment in Osaka - Stainless steel processing [Leave cost reduction to Philir Co., Ltd.]
- Other semiconductor manufacturing equipment
- Etching Equipment
- Molding Equipment
This device enables vacuum degassing, temperature control, automatic measuring, mixing, and precise dispensing of two-component resins such as polyurethane, epoxy, and silicone!
- Mixer/agitator
- Molding Equipment
- dispenser
A high-thrust air cylinder that integrates a hydraulic cylinder and an air-hydraulic conversion booster device in a compact form.
- Hydraulic Equipment
- Molding Equipment
- Other machine elements
Hot melt application system for protecting and waterproofing electrical components and electronic circuit boards.
- Molding Equipment
Achieving high-speed and low-cost encapsulation and molding of electrical components and electronic substrates.
- Molding Equipment
![Damper rubber [Boushin rubber]](https://image.mono.ipros.com/public/product/image/9aa/2000167857/IPROS5317482699408592778.jpg?w=280&h=280){kind=small}
Control of vibrations for all devices. Stable vibration support can be provided as vibration-damping rubber. Manufacturing of vibration-damping component molded products.
- Rubber
- Other semiconductor manufacturing equipment
- Molding Equipment
Smart design & easy operation! 60/100/120 ton manual press
- Other semiconductor manufacturing equipment
- Molding Equipment
Visible Mechanism & Easy Operation
- Other semiconductor manufacturing equipment
- Molding Equipment
Slim Design & Easy Operation
- Other semiconductor manufacturing equipment
- Molding Equipment
All view & easy access! Servo clamp 60 ton automatic molding device.
- Other semiconductor manufacturing equipment
- Molding Equipment
All-view & easy access! 100-ton servo clamp automatic molding device.
- Other semiconductor manufacturing equipment
- Molding Equipment
Visible Mechanism & Easy Operation
- Other semiconductor manufacturing equipment
- Molding Equipment
All view & easy access! Servo clamp 140 ton automatic molding device.
- Other semiconductor manufacturing equipment
- Molding Equipment
Visible Mechanism & Easy Operation
- Other semiconductor manufacturing equipment
- Molding Equipment
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-frequency preheater
- Resin processing machine
- Other heaters
- Molding Equipment