We will provide suitable proposals for the packaging process design that you desire!
We handle the packaging process systems from Besi. With a modular-based equipment and a common software platform, it is also possible to design manufacturing lines that transcend category boundaries. We have suitable proposals for the packaging process design that our customers desire. 【Three Categories】 ■ Molding Equipment ■ Trim and Form Equipment ■ Cutting Equipment *For more details, please download the PDF or contact us.
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basic information
【Product Lineup】 ■ Wafer Molding ・Fico Molding Line ■ Lead Frame/Substrate Molding ・AMS-i ・AMS-W ・AMS-LM ・AMS-X (Coming soon) ■ Trim and Form ・Fico Compact Line ・Fico Compact Line-X ・Fico Compact Line-P ■ Singulation ・Fico Sawing Line *For more details, please download the PDF or contact us.
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Applications/Examples of results
**Application Achievements** ■ Wafer Molding - Wafer Mold, Exposed Die Wafer Mold ■ Lead Frame/Substrate Molding - Mold Underfill, Exposed Die Mold, Multi-layer Substrate Mold, Selective (Partial Selection) Mold, Dual Side Mold, SOP / QFN / QFP Lead Frame Mold, Power Semiconductor Mold ■ Trim and Form - SOP / QFP / QFN Lead Frame Trim and Form, Power Semiconductor Trim and Form ■ Singulation - BGA Substrate Cutting, Wafer-based Module Cutting, QFP / QFN Lead Frame Cutting, Wettable Flank (Half Cut), Electromagnetic Shield (EMI Shield) Substrate Cutting *For more details, please download the PDF or contact us.*
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Company information
Our company is the exclusive agent in Japan for Besi (BE Semiconductor Industries N.V.) and cyberTECHNOLOGIES (cyberTECHNOLOGIES GmbH). We provide various manufacturing equipment for semiconductor backend processes and high-resolution three-dimensional shape measurement systems. Please feel free to contact us if you have any inquiries.