【High Precision】"Contract Development and Processing Service for Edge/Surface Polishing of Circuit Boards"
The shape and surface accuracy of the substrate, as well as its strength, have improved! It also prevents damage and roughness in subsequent processes, leading to improved yield!
Our company is currently offering a "contract development and processing service for substrate edge/surface polishing" utilizing our extensive polishing know-how and precision polishing equipment and materials. Our unique polishing process achieves high precision in shape and surface accuracy, and by mirror-finishing the edge, we also enhance the strength of the substrate! This service provides numerous benefits, such as preventing damage in subsequent processes and reducing roughness at the outer edges that can easily occur during film formation, leading to improved yield and quality. 【Features】 ■ Edge processing available for diameters from φ8mm to φ450mm ■ Scrub cleaning possible after polishing ■ Well-equipped evaluation facilities! Quality checks and evaluations before and after processing are also supported ■ Capable of mirror finishing difficult-to-cut materials such as titanium and SiC *For more details, please download the catalog or contact us.
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basic information
The features of Mipox's contract processing are as follows: 1. Using our own developed polishing equipment, 2. Utilizing precision polishing materials manufactured in-house, 3. Establishing a polishing process that cannot be replicated by other companies, we respond to our customers' requests. We accept contract development and processing tailored to meet customer needs, achieving the desired shape and surface accuracy from the edges to the surfaces of various workpieces. *For more details, please download the catalog or contact us.
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Applications/Examples of results
●Supported Materials 《Various Semiconductor Substrates》 Si, SiC, GaN, GaAs, Sapphire, LiTaO3, LiNbO3, SiN, AlN, SiN, various composite materials, etc. 《Various Metal Substrates》 Cu, Al, SUS, Ti, Au, Ag, W, etc. 《Various Glass Substrates》 Quartz, Pyrex glass, tempered glass, soda glass, etc.
Detailed information
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Size reduction (cutting) processing of various semiconductor substrates. We accept orders from one piece using the optimal processing method tailored to your application, such as laser cutting or grinding.
Company information
At Mipox, we have developed a business centered around the core technologies of "coating," "cutting," and "polishing" by applying our foil manufacturing technology. Recently, our polishing quality has reached a level where "there are no inspection devices available in the market," which has also supported the expansion of inspection equipment. Currently, we have added "viewing" technology to our core technologies, making it "coating, cutting, polishing, and viewing." Mipox not only manufactures its own products but also engages in contract business. In addition to polishing films and liquid polishing agents, we also handle polishing equipment, which not only enables contract processing operations but also allows us to make proposals from the user's perspective. We have established a one-stop solution system that can address everything from product provision to contract development and processing, contributing to the reduction of user workload. We also welcome various inquiries related to polishing, so please feel free to consult with us.
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