This is a high-frequency power supply that performs matching adjustments by varying the frequency.
Features No matching box required, compact design, and cost reduction achieved No moving parts due to electronic control, maintenance-free Ultra-fast matching achieved ■ NR1S13M-01 Output power range: 0 to 1200W (when using internal calibration function) Maximum rated power: 1000W Rated maximum output: 1000W (continuous at 50Ω load) Output method: Continuous output Output impedance: 50±2Ω RF output connector: HN-R Output adjustment range: 0 to 1200W continuously variable (set in 1W increments) Rated output power: 1000W Output frequency: 13.56MHz Frequency stability: ±0.01% (10 to 40°C) crystal oscillation Frequency variable range: 13.2MHz to 15.0MHz (limited to F-match operation) Cooling method: Forced air cooling, rear exhaust External dimensions: W430×D640×H174 Weight: Approximately 29kg
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basic information
Features No matching box required, compact design, and cost reduction achieved No moving parts due to electronic control, maintenance-free Ultra-fast matching achieved ■ NR1S13M-01 Output power range: 0–1200W (when using internal calibration function) Maximum rated power: 1000W Rated maximum output: 1000W (continuous at 50Ω load) Output method: Continuous output Output impedance: 50±2Ω RF output connector: HN-R Output adjustment range: 0–1200W continuously variable (settings in 1W increments) Rated output power: 1000W Output frequency: 13.56MHz Frequency stability: ±0.01% (10–40°C) crystal oscillation Frequency variable range: 13.2MHz–15.0MHz (limited to F-match operation) Cooling method: Forced air cooling, rear discharge External dimensions: W430×D640×H174 Weight: Approximately 29kg
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Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
RF Technologies has been involved in the development and design of high-frequency technologies since the time high-frequency power supplies began to be used in plasma processes, including "demonstration research," "material development," "surface modification," "semiconductor manufacturing," "FPD manufacturing," and "solar cells." Fortunately, we have had the opportunity for technical collaboration and exchange with academic researchers and major semiconductor manufacturing equipment manufacturers at the forefront of global technology. We have experienced many instances where the alignment of our technologies was essential to solving issues that overlap between areas that equipment manufacturers need to address and areas that power supply manufacturers need to resolve.
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