We provide comprehensive technology related to electronic devices from specification creation to development, design, manufacturing, and evaluation.
At Nippon Universe Co., Ltd. - Printed Circuit Board Division, we utilize the technology we have cultivated over 48 years to respond to printed circuit board design, manufacturing, and assembly with small quantities and short lead times. We are enhancing our simulation technology to aim for higher quality designs. In wiring design, we can significantly shorten design lead times through a simultaneous parallel design system. We support the establishment of ultra-short lead time lines that operate on weekends and holidays, as well as provide assistance from numerous satellite design offices across the country. We also handle the preparation of documentation related to circuit boards and have extensive experience in high-speed signal design (LVDS2, DDR2, DDR3). Regarding manufacturing (outsourcing), we can accommodate short lead times for single-sided boards to 36-layer high multilayer boards, as well as various types of board manufacturing (high multilayer boards, flex, ceramic boards, BGA). We select the optimal factory based on customer requirements (high difficulty, budget, lead time). For component assembly (outsourcing), we can achieve high-quality assembly with the latest equipment (maintaining a defect rate of 0.003 or lower). We respond to short lead times through manual assembly and mounting machines. For more details, please contact us or download our catalog.
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【Printed Circuit Board Business Achievements】 ○Circuit Board Manufacturing Technology →IVH, Build-up, Pad-on-Through Hole →Line & Space 50μm/50μm →High Aspect Ratio, Thickness 5.0t, Hole Diameter 0.35Φ →Thickness Range 0.1t to 6.5t →High Layer Count, 36 Layers Achieved →Thick Copper Foil, 105μm (for High Current Boards) →Special Material Compatibility: Polyimide, Teflon, Gore-Tex, etc. ○Special Circuit Board Manufacturing Achievements →Probe, DUT Boards →Interposer Boards →Sheet Transformer Boards →Rigid-Flex Boards, etc. ○High-Density Circuit Board Design →VME 6U Size, 16,000 Pins, Build-up 1-14-1 Configuration →Inner Layer Core IVH, Pad-on-Through Hole ○Impedance Control Circuit Board Design →Single Ended, Differential, Coplanar, Differential Coplanar ○Compliance with Various Standards: VME, CPCI, PCI Express, etc. ○High-Frequency Design: 2.4GHz ○CPU Boards: Using DDR, DDR2, etc. ○Others: Equipment for Broadcast Camera Systems, Video Transmission System Equipment, etc. ●For more details, please contact us or download the catalog.
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Japan Universe Co., Ltd. provides comprehensive technology related to electronic devices, from specification creation to development, design, manufacturing, and evaluation. We have established an environment that allows for consistent production of all processes, enabling high quality, small lot sizes, a variety of products, and short delivery times. At Japan Universe, our staff, filled with a spirit of frontier innovation, is dedicated to the creation of new era technologies that support people's lives, continuously honing their skills every day. There is no such thing as "high-end" in the field of technology. As we continue our technology adventure yesterday, today, and tomorrow, we aim to contribute to the development of the industry and actively engage in the promising future of technology development as adventurers walking at the forefront of evolving science and technology. Please feel free to consult with us.
