We can also handle poor analysis! We provide specific measures from cause identification in a short period of time.
In K-All's failure analysis, it is easy to categorize the causes of defects by swapping devices between good and defective boards. We also accept analyses after the cause of the defect (device, board, assembly) has been identified. In failure analysis, it is important to narrow down the cause accurately at the outset. As the first step, we quickly and easily determine whether the issue lies with the components or the board using K-All's rework technology. 【Features】 - Rapid and easy execution of failure analysis using rework technology - Provision of specific countermeasures from cause identification in a short period - Analysis after the cause of defects is identified is also available For more details, please contact us or download the catalog.
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basic information
【Case Study】 [Want to identify the cause of defects in FPGA-equipped boards] ○ Examine potential causes in cases of board defects, assembly issues, and component failures, and identify the thermal impact range due to rework. ○ Create a rework temperature profile that does not cause thermal damage using a dummy board. ○ Propose FPGA swap implementation. ○ Propose reballing the removed FPGA and re-implementing it. [Want to replace BGA packages to analyze defective ICs] ○ Remove underfill and detach the defective package for analysis. ○ Verify the single defect of the relevant package by attaching a new package to the removed area and confirming normal operation. ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
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