It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.
By using a twin-arm robot, efficient operation has become possible, allowing for processing in a short time. Measurement data is automatically saved in an Excel file.
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basic information
- The thickness measurement position of the wafer is at the center point. Please consult us if multi-point measurements are needed. - Sorting is done by rearranging within the same lot cassette, so if the sorting rank is high, the percentage of cases where rearrangement is not performed increases, thus reducing the total processing time. - A barcode reader can be included upon request.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.