It is a device that measures the thickness of silicon wafers and rearranges them according to their thickness.
By making the stage three-tiered, it has become possible to process more wafers. Measurement data is automatically saved in an Excel file.
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basic information
- The thickness measurement position of the wafer is at the center point. Please consult us if multiple measurements are needed. - Up to 30 cassettes can be loaded. If using 25 sheets per cassette, a maximum of 750 sheets can be set. - A barcode reader and label printer can be included upon request.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.