This is a device that measures the thickness of sapphire wafers and sorts them according to their thickness.
By sorting, we prevent wafers with abnormal thickness from flowing into the next process. By measuring the thickness before and after wafer processing, we can also manage the processing conditions. Additionally, by standardizing the thickness for each cassette, the processing quality in the next step is improved.
Inquire About This Product
basic information
- The thickness measurement pattern for the wafer consists of three points in a straight line along the diameter. It can also accommodate other measurement patterns (e.g., cross 5 points, straight line 5 points). - Based on the measured thickness, sorting will be performed into pre-specified cassettes. The thickness sorting categories can be set arbitrarily. - The measured data will be saved in an Excel file on the accompanying computer. The format for saving can be adjusted to meet various requests. - The number of Load/Unload stages can be customized according to various requests (e.g., 3 load stages, 6 unload stages).
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.