It is a device for inverting and transferring silicon wafers.
- The handling of silicon wafers using an outer peripheral hanging method allows for the transfer of ultra-thin wafers. - The robot's hand is made of ceramic, and Teflon is used for the clamps in the inversion section. - There are three carrier ports, with two used for loading and unloading, and the remaining one used as a buffer.
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We have received orders from the semiconductor industry.
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☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.