A device capable of performing three types of operations.
This device can perform three types of operations: extracting from a 6.8-inch wafer cassette (Load Mode), storing into a cassette (Unload Mode), and alternating between Load Mode and Unload Mode (In-and-Out Mode).
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basic information
- Continuous operation from above or below the cassette. Additionally, it is possible to store and retrieve from the specified SLOT. - With casters equipped with stoppers, you can move it to the desired location for use. Just plug it into a standard 100V outlet for power.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.